What is DIP (Dual In-line Package)?

DIP (Dual In-line Package)

  • DIP (Dual In-line Package) was developed in 1960 by Intel.
  • DIP (Dual In-line Package) is mounted in PCB(Printed Circut Board).
  • The shape of DIP is Rectangular.
  • The DIP is used because number of Transistor package handel the number of connection in IC.
  • DIP has 2 parallel Row of electrical connecting pin.

What is DIP (Dual In-line Package) / DIP in detail .

  • The above photo shows three DIP14 ICs. Common packages have only four and 64 leads.
  • DIP is made from plastic pressed around silver frame that support device interface and provide connection.
  • The DRAM chip is used in DIP packaging.

  • DIP is used for processor when the number of signals going to and from them grew large scale data transmission.
  • DIP packages include many analog and digital integrated circuit types, such as transistor panels, switches, light diodes, and resistors. Standard IC sockets may include DIP plugs for ribbon cables.

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Know about the more packaging in detail click in given link.
  1. PGA (Pin Grid Array).Click Here
  2. SGPA (Staggerd Pin Grid Array).Click Here
  3. MCM (Multi Chip Module).Click Here
  4. LCC (Leadless Chip Carrior).Click Here
  5. PLCC (Plastic Leaded Chip Carrior).Click Here
  6. TC (Tape Carrior).Click Here
  7. CPU Packaging in detail.Click Here

What is DIP (Dual In-line Package) / DIP in detail .